In this paper, a review on microplasma discharges is conducted. The different types and configurations used in
microplasmas such as the Cathode Boundary Layer (CBL), Dielectric Barrier Discharge (DBD), Capillary Plasma
Electrode Discharge (CPED), Inverted Square Pyramid (ISP), Square Cross Sectional Cavities (SCSC), Radio Frequency
Inductively Coupled Discharge (RFIC), Radio Frequency Capacitive Coupled Discharge (RFCC), Micro-Hollow Cathode
Discharge (MHCD), and microstrip technology (MS) discharges at different operating conditions are discussed.
Numerical and experimental methods used for the analysis of the physics involved in these microplasmas, as well as the
different construction methods used, are also described.